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行业动态

HOLTEK推出微控制器HT32F542xx系列
2021年半导体厂商在先进封装领域的资本支出约为119亿美元
预计2026年中国大陆晶圆代工厂占全球份额为8.8%
俄乌冲突下缺芯危机或加深！东芝：供应紧张将至少持续到明年3月
中兴通讯XGS-PON助力Orange 华为发布无线智能化架构
电气维修方法论第二十篇（电气元件的规格封装）

模拟技术

MACOM推出业界首套基于模拟CDR的PAM-4产品组合
首尔半导体推出最新专利Acrich模组 适用于全角度球泡灯
中国科学院宁波材料所利用全景成像技术研制虚拟现实视觉传感器
CSR公司推出Soundbar范例设计方案
TRINAMIC推出全球*集成RISC-V 内核的片载电机驱控芯片系统
艾睿电子推出针对Altera的非易失性Max 10 FPGA的评估板