国内最专业的IC销售商
北京耐芯威科技有限公司
Beijing NaiXinWei Technology Co., Ltd.
首页
库存查询
新闻中心
产品与服务
网上订购
在线留言
联系我们
国外订货

索引目录：搜索IC型号供应商,PDF资料,价格以及相关电子芯片信息！更多查询请进入ic72.com

字母检索： A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
数字检索： 0 1 2 3 4 5 6 7 8 9

s索引目录：

[001] [002] [003] [004] [005] [006] [007] [008] [009] [010] [011] [012] [013] [014] [015] [016] [017] [018] [019] [020] [021] [022] [023] [024] [025] [026] [027] [028] [029] [030] [031] [032] [033] [034] [035] [036] [037] [038] [039] [040] [041] [042] [043] [044] [045] [046] [047] [048] [049] [050] [051] [052] [053] [054] [055] [056] [057] [058] [059] [060] [061] [062] [063] [064] [065] [066] [067] [068] [069] [070] [071] [072] [073] [074] [075] [076] [077] [078] [079] [080] [081] [082] [083] [084] [085] [086] [087] [088] [089] [090] [091] [092] [093] [094] [095] [096] [097] [098] [099] [100] [101] [102] [103] [104] [105] [106] [107] [108] [109] [110] [111] [112] [113] [114] [115] [116] [117] [118] [119] [120] [121] [122] [123] [124] [125] [126] [127] [128] [129] [130] [131] [132] [133] [134] [135] [136] [137] [138] [139] [140] [141] [142] [143] [144] [145] [146] [147] [148] [149] [150] [151] [152] [153] [154] [155] [156] [157] [158] [159] [160] [161] [162] [163] [164] [165] [166] [167] [168] [169] [170] [171] [172] [173] [174] [175] [176] [177] [178] [179] [180] [181] [182] [183] [184] [185]
4306/11089 120条/页 共1330644条 [1] ... [4301] [4302] [4303] [4304] [4305] [4306] [4307] [4308] [4309] [4310] [4311] ... [11089]

行业动态

HOLTEK推出微控制器HT32F542xx系列
2021年半导体厂商在先进封装领域的资本支出约为119亿美元
预计2026年中国大陆晶圆代工厂占全球份额为8.8%
俄乌冲突下缺芯危机或加深！东芝：供应紧张将至少持续到明年3月
中兴通讯XGS-PON助力Orange 华为发布无线智能化架构
电气维修方法论第二十篇（电气元件的规格封装）

模拟技术

MACOM推出业界首套基于模拟CDR的PAM-4产品组合
首尔半导体推出最新专利Acrich模组 适用于全角度球泡灯
中国科学院宁波材料所利用全景成像技术研制虚拟现实视觉传感器
CSR公司推出Soundbar范例设计方案
TRINAMIC推出全球*集成RISC-V 内核的片载电机驱控芯片系统
艾睿电子推出针对Altera的非易失性Max 10 FPGA的评估板