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行业动态

预计2022年半导体行业资本支出将大增24%至1904亿美元
汽车行业“缺芯”阴霾不散 丰田进一步削减日本国内产量
TDK的TMR传感器用来控制电机工作设备
斥资120亿日元，MLCC龙头村田再扩产
电气维修方法论第二十篇（电气元件的规格封装）
小米入股汉威科技子公司，布局柔性传感器

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真假难辨 日本创客制仿真3D打印扑翼机
Teseq推出增强型NSG 438 ESD模拟器
TI新一代PSE控制器加速以太网供电发展
骁龙820和Kryo CPU：异构计算与定制计算的作用
集成式RF采样收发器支持快速跳频、多频带和多模式操作
安森美半导体用于安防的网络摄像机方案