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北京耐芯威科技有限公司
Beijing NaiXinWei Technology Co., Ltd.
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行业动态

RS9116W Wi-Fi物联网无线模块的连接能力
预计2022年半导体行业资本支出将大增24%至1904亿美元
斥资120亿日元，MLCC龙头村田再扩产
2021年半导体厂商在先进封装领域的资本支出约为119亿美元
触控笔和电容笔的区别
瑞萨电子宣布推出R-Car V4H片上系统 深度学习性能高达34 TOPS

模拟技术

泰克推出满足中国最新LED模块测试规范功率分析仪PA1000
博通25/50G以太网控制器助云端市场应对虚拟化挑战
Microchip重夺8位单片机销售额全球第一桂冠
中国科学院宁波材料所利用全景成像技术研制虚拟现实视觉传感器
安森美半导体用于安防的网络摄像机方案
AMS全新磁性位置传感器在高速旋转下提供最佳精确度